MODEL 300 WAFER/FILM FRAME TAPE APPLICATOR
Product Description:

OVERVIEW

Semiconductor Equipment Corporation’s wafer/film tape applicator provides users with the optimal control of temperature and pressure for achieving uniform bubble-free mounting of electronic grade processing tape onto wafers and their film frames for subsequent cutting of wafers into die. The Model 300 is specifically designed for 300mm wafers.

 

FEATURES

  • Up to 12” wafer capability standard.
  • Accepts all film frames (specify type and size).
  • Manual tape feed.
  • Manual tape tensioner.
  • Compatible with standard or interleaved tape.
  • Vacuum stage wafer hold-down.
  • Heated vacuum stage adjustable to 60 degrees C. maximum.
  • Built in cutter tape separation systems.
  • Captive roller assembly assures consistent wafer / film frame contact pressure.
  • Adjustable spring loaded platen for optimum contact pressure.
  • CE Certification.
  • Manual.
  • Standard aluminum anodized chuck for 300mm wafers or
  • Teflon chuck for thin wafers to minimize stress during application.
MODEL-300-WAFERFILM-FRAME-TAPE-APPLICATOR.pdf
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