MODEL 3150 WAFER/FILM FRAME TAPE APPLICATOR
Product Description:

OVERVIEW

Semiconductor Equipment Corporation’s Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. Uniform, bubble-free mounting of tape for wafer dicing is the result. State-of-the-art features make them two of the most advanced systems available. The Model 3100 handles wafers up to 6″ in diameter, while the Model 3150 handles any size wafer up to 8″ in diameter. Both models are so versatile, they can operate with virtually any film frame.

FEATURES

  • Up to 8″ wafer capability standard.
  • Accepts all film frames (specify type and size).
  • Manual tape feed.
  • Manual tape tensioner.
  • Compatible with standard or interleaved tape.
  • Vacuum stage wafer hold-down., adjustable to 60 º C. maximum.
  • Built in peeler assembly for tape separation.
  • Captive roller assembly assures consistent wafer/film frame contact pressure.
  • Adjustable spring loaded platen for optimum contact pressure.
  • CE Certification.
  • Manual.
SEC-Model-3100-3150-Brochure-1.pdf
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Video: https://www.semicorp.com/images/products/videos/Model%203100-3150.mp4