MODEL 3200 WAFER/BACKLAP APPLICATOR » Chip Hua Equipment & Tools Pte Ltd
MODEL 3200 WAFER/BACKLAP APPLICATOR
Product Description:

OVERVIEW

Semiconductor Equipment Corporation´s Model 3200 and 3250 apply Protective Tape to Your Wafer Prior to Backlapping. The applicator also:

  • Eliminates bubbles between tape and wafer
  • Provides uniform tension between tape and wafer
  • Operates with backed and non-backed tape
  • Provides adjustable roller pressure
  • Cuts tape within .005 ” of edge of wafer

FEATURES

Model 3200

  • Up to 6″ wafer capability standard.
  • Trims tape to the edge of the wafer including the flats, within .005″.
  • Manual tape feed.
  • Manual tape tensioner.
  • Compatible with standard or interleaved tape.
  • Vacuum stage wafer hold-down.
  • Built in cutter tape separation systems.
  • Captive roller assembly assures consistent wafer/film frame contact pressure.
  • Adjustable spring loaded platen for optimum contact pressure.
  • Manual.
SEC-Model-3200-Brochure.pdf
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Video: https://www.semicorp.com/images/products/videos/Model%203250.mp4