MODEL 835 PICK AND PLACE SYSTEM » Chip Hua Equipment & Tools Pte Ltd
MODEL 835 PICK AND PLACE SYSTEM
Product Description:

OVERVIEW

The Model 835 is a general purpose pick and place system for die and surface mount components.  The 835 offers manually or pneumatically controlled Z motion with semiautomatic vacuum pickup tool movement for transferring die and other small devices from tape or carrier trays to packages.  A footswitch option controls the pick – up head to lower the pickup tool to working height and return it home.  Open frame design assures full visiblilty and complete access of all system components.  Operator friendly – takes less than two minutes to learn to operate.  Epoxy die bonding capability can be easily added.  The 835 works with any tape – mounted die removal system, including S.E.C.’s Model 4800 heated tape expanding die ejector grid featuring a grid plate that can be machined with one of two different pyramid pitches.

OPTIONS

  • Die tray pedestal capable of holding up to four 2″ X 2″ waffle packs.
  • Semiautomatic Z motion.
  • Flat vacuum chuck capable of holding up to four 2″ X 2″ waffle packs.
  • Stereo zoom microscope and/or projected image cross hair system.
  • High intensity illuminators.
  • Dual position pivoting head for epoxy dispensing.
SEC-Model-835-Brochure.pdf
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Video: https://www.semicorp.com/images/products/videos/Model_830_with_Poker.mp4