Semiconductor Equipment Corporation´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up from a waffle pack, dipped into flux and then placed on a substrate.
An optional heated stage (Model 855) is available. An additional option, SEC´s Model 430 Hot Gas Jet Module can be integrated to operate on the Model 850 as a spot heating source for airflow.