MODEL 850 FLIP CHIP PLACEMENT SYSTEM » Chip Hua Equipment & Tools Pte Ltd
MODEL 850 FLIP CHIP PLACEMENT SYSTEM
Product Description:

OVERVIEW

Semiconductor Equipment Corporation´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up from a waffle pack, dipped into flux and then placed on a substrate.

An optional heated stage (Model 855) is available. An additional option, SEC´s Model 430 Hot Gas Jet Module can be integrated to operate on the Model 850 as a spot heating source for airflow.

FEATURES

  • Manual X, Y sliding table with 13 ” x 5 ” of travel and ergonomic control arm.
  • Micrometer adjusted X,Y and Theta stage for fine alignment.
  • Pneumatic brakes for XY table movement.
  • 4″ square flat vacuum chuck.
  • Cube beam splitter vision system with simultaneous view of die and substrate patterns for alignment.
  • Motorized zoom lens, color camera and TV monitor.
  • Four independent fiber optic ring light illuminators. Two for die and two for substrate illumination.
  • Viewer automatically retracts when Z motion is activated.
  • Automatic Z motion with pneumatic bond control panel adjusted.
  • Pick up tool.
  • Set up kit.
  • Manual.
SEC-Model-850-Brochure.pdf
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Video: https://www.semicorp.com/images/products/videos/Model_850.mp4