DESCRIPTION
The BT302 Benchtop Hot Air Reflow Oven is equipped with a full hot air convection system, to ensure heating of components and PCB evenly, preventing shadow effects and color sensitivity during the soldering process. It also comes with a Dynamic Thermal Profile system,
where the heat control and fan speed are adjusted based on the real-time feedback of the actual temperature measured on the product, to achieve greater thermal accuracy. This system is suitable for product development, prototyping and small scale production as it allows solder profiles to be easily set up and stored with an app, offering fantastic control in the reflow process that is usually only available in larger, and more expensive hot air reflow ovens.