Hugle Container Cleaning & Ultrasonic Dry Cleaning Systems

SMIF Pod Cleaning System

The IA-8 is a manually loaded SMIF pod washing system. This system is for cleaning semiconductor device containers and is built with experience advanced knowledge of the latest technology for Semiconductor equipment manufacturing.. It is suitable for pilot lines, research and development. The IA-8 can wash and dry 8 inch SMIF pods and also can wash 8 inch open cassettes.

• SMIF POD inside/outside cover, inner base are cleaned & dried simultaneously by DI Water jet washing/high pressure hot air knife drying
• POD rotation for precise cleaning and drying by point-blank set nozzle
• Prevention of bacteria growth by drain a little DI water except machine is in cleaning process
• Simple operation by touch panel
• Small foot print design
• Sequence controlled by PLC
• Flushing function to prevent dead water inside the tank
• Operator friendly various safety systems
• Easy maintenance
• Various options are available for specific customer needs

FOUP/FOSB Cleaning System

Cleaning FOUPs and FOSBs is required to improve and maintain the yield of the semiconductor manufacturing process. The IF-12 can wash and dry a variety of FOUPs and FOSBs in one system without changing the set-up because of our unique chamber structure.

• High through-put (compared with our previous system)
• Small foot print design
• Protection from electrostatic charge
• Super purity washing by nozzle jet
• Hot air knife drying method will shorten drying time efficiently
• Automatic FOUP Opener function (option)
• Complete Drying by reliable and successful “hot air spraying” and “high speed spin”
• Dust suppression, ESD elimination system equipping with fine filter and Ionizer
• Securing working space for disassemble & assemble container (no need to arrange clean booth separately)
• Automatic purging function to prevent growth of bacteria
• Auto flushing fuction prevents dead water
• Easy operation by touch panel
• Ensure High safety with completion of various interlocking system

Semi-Automatic Cassette and Box Cleaning System

The Hugle SC-8 is the solution you need to clean all types of wafer carriers and boxes up to 8” in a single system. The SC-8 is a new generation semi-automatic cassette and box cleaning system. This model features energy efficient, space saving, trouble free design. Special water and air nozzles wash and dry containers as they are transported through the system in wire trays. Hugle has built on the strong performance and reliable design of the earlier CRD-4500. There are also design improvements that increase drying efficiency and reduce system cost. Cost savings have resulted in substantial price reductions.

• Several kinds of container can be washed
• Small foot print/Energy Saving design
• Hugle Super-precision cleaning by our unique washing
• Highly efficient hot air knife for quick drying
• Surfactant wash, DIW rinse feature available
• Compliance to various standards (SEMI standard,CE marking,UL)
• Can accommodate many kinds of containers up to 8”
• Easy operation with touch panel screen
• Process recipe setting per tray
• Outstanding washing/and drying performance
• Equipped with Anti-static device
• Over 300 installed base shows high reliability

Fully Automatic Recticle Pod Cleaning System

The SR-EUV/200/150 is Hugle’s fully automatic cleaning system for EUV Reticle PODs, RSP-200 and RSP-150. Cleaning these pods is one of the most demanding applications for container cleaning equipment in the Semiconductor Industry. Hugle has met the challenge with innovative technology and unmatched system reliability. The EUV pod is automatically fed into the system, outer and inner pods are disassembled and placed into separate cleaning chambers where they are washed and dried using our unique technology. They are then reassembled and delivered to the load port..In the case of RSP-200 and RSP-150 only one cleaning chamber is included. Pods are efficiently washed and dried without exceeding recommended temperatures. The SR-EUV/200/150 successfully removes nanometer sized particles in a fully automatic on line system compatible with industry standards.

• Small Foot print
• Unique cleaning technology
• Completely dry by high effeciency drying method
• Fully automatic open/close pod for preventing cross-contamination
• Also cleans RSP200
• Built in Robot hand self cleaning system
• Inner pod cleaning chamber(Not included for RSP-200/150)
• Outer pod cleaning chamber
• Pods can be loaded manually

SORA Fully Automatic FOUP Cleaning System

300mm wafers have become the industry standard for semiconductor development and manufacturing. Exceptional FOUP cleaning is required for advanced products especially with the introduction of EUV lithography. Hugle Electronics has built on the solid performance of the UPC-12100 by introducing the UPC-12500. The 12500 is a fully automatic FOUP Cleaning System with excellent performance, throughput and reliability. Advancements for the new system include higher throughput, energy savings, and a smaller footprint. The UPC-12500 was designed and manufactured based on SEMI standard, UL and CE marking. It is also compatible with Automated Material Handling Systems (AMHS) like OHT or RGV and Communication protocol (GEM300), so it is suitable for On-line control.

• High Throughput – 3 advanced load ports, buffers, and transfer robot
  (20% increase to conventional system)
• Exceptional reliability
• 7 FOUP storage capacity
• Multi-joint robot operates inside for higher safety
• Lower Cross Contamination Risk: compact front-door and fully automated FOUP opening/closing
• Small Footprint: Built-in tank unit with UPS
• Energy saving
• Prevent cross contamination risk
• Enhanced Maintainability
• Super High Purity Cleaning – 2-fluid high pressure jet cleaners
• Cleanliness of CLASS 10 or higher
• Hot air knife drying and FOUP door spinning facilitate the drying process
• Compliant to various standards – SEMI, GEM300, CE, UL

Ultrasonic Dry Cleaning Systems

The Hugle Ultrasonic Dry Cleaner can remove non-magnetic foreign particles down to 1 micron in size which cannot be removed by magnetic bars. It is an innovative non-contact dry cleaning system which generates ultrasonic air to move particles and then collect them by vacuum airflows with no damage to workpieces. The cleaner can be installed in any environment as it does not require electrical power to operate. Applications include N2, dry room and clean room environments.