Malcom Dip Tester

Malcom DS-11S Dip Tester for Selective Solder Machine

• Solder Temperature Sensor: Special Feature for DS-10S with a small heat capacity to accurately measure solder temperature and atmosphere of the device.
• Dip Time Sensor: Detects electrical continuity and measures solder contact time.
• Pre-heat Sensor: Measures the increase and peak in temperature in the sensor board to allow more control over the state of the device.
• Measurement of Moving Speed: Measures the size of the nozzle by scanning X and Y on two dip time sensors.
• Profile Measurement: Displays the profile of the solder temperature sensor and preheat sensor.
• DS-10S Software: Performs various management functions such as OK/NG judgment and data analysis. (Pre-heat temp. Dip time, Solder temp, X-Y speed, Solder size X, Y and etc.)

Malcom DS-11 Dip Tester for Selective Wave Soldering

•  The dip tester is placed in a conveyor to flow through a solder bath to obtain information needed to manage it. Data is then transmistted to a PC via USB cable to create a temperature profile.
• Comes with a software that enables OK/NG judgement and management of test results.
• The created temperature profile makes it possible to monitor the sampling temperature of the preheat and solder temperature sensors, in addition to the conventional management items.
• The heat-resistant cover for high heat load such as nitrogen oven is available as an option.
• Equipped with a New Dip Time Sensor, providing a more accurate measurement.