Malcom Solder Paste Tackiness Tester

Malcom TK-1S Solder Paste Tackiness Tester

• Measures the adhesive strength quantitatively in terms of tackiness, load and insertion depth of materials such as solder paste.
• 3 insertion methods to make the measurement conditions more consistent with the actual mounting manner.
• It is essential to feedback the difference in tackiness under different conditions to the production site quickly to prevent problems like dropping components.