Malcom Wetting Tester

Malcom SWB-2 Dip Wetting Tester

• Compliant to JIS, ISO, IEC, IPC & MIL standard
• The entire procedure, from flux application (w/ Flux Temperature Control Function) to measurement end is automated. Reducing unstable measurement results, and user error.
• Complies with the wetting test method according to JIS Z3198 (Lead Free Solder Test Method) standards.
• Easily change solder and flux when necessary.
• Electro-balance sensor detects a small force.
• Efficiently analyzes data with the exclusive PC software. (Optional)
• An optional cover allows for wetting evaluation in a N2 environment. (Optional)
• Micro Wetting Balance Measuring method is available. (Optional)

Malcom SP-2 Solder Paste Wetting Tester

• SP-2 is wettability testing machine for solder paste, parts electrode and PC board, adopting SP-Tension-Method （Temperature Profile Method).
• Evaluates wettability of lead free solder (solder paste, component and temperature conditions).
• User can observe all wetting processes through the glass windows of the unit.
• Optional methods available: Wetting balance measuring method, micro wetting balance.
• Powerful heaters and pre-heating function are built into the device to simulate the temperature profile of the actual reflow process or that of the optimal profile.
• The wettability evaluation of micro chip components such as 1005 and 1603 size is available.
• Comes with a software that automatically analyzes test resutls of wetting time, wetting force, etc.