PACE BGA Rework Systems

PACE IR3100 Infrared BGA Rework Station

The IR 3100 can easily install and remove BGA, QFN, μBGA/CSP, Flip Chip and other SMD’s. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3100 does not require nozzles. A specially-developed IR pyrometer provides non-contact, real-time, closed-loop temperature control throughout the reflow process. A Sodr-Cam Reflow Camera comes standard, allowing you to watch the entire reflow process in real time. The IR 3100’s Windows-based software makes profiling incredibly simple for even the most advanced applications, providing intuitive set-up, multi-stage profiling, on-the-fly profile adjustment, flux-dipping, unlimited profile storage and much more.

• No. 8007-0586
• Non-Contact IR Pyrometer
• Ultra-High Precision Placement Capability
• High Sensitivity Vacuum Pick
• Sodr-Cam Reflow Camera
• Height Adjustable Bottom-Side Preheater
• High-Definition Optical Alignment System
• Quad-Field Imaging for Large/Fine Pitch BGA’s
• Integrated Board Support Wand
• Power Distribution Graph
• Sensor Offset
• Made in the USA

PACE IR4100 Infrared BGA and SMD Rework Station

The IR4100 can easily install and remove BGA, QFN, μBGA/CSP, Flip Chip and other SMD’s. Featuring a 500W infrared (IR) top heater and 1900W IR bottom preheater, comprising 1x1000W IR Heater and 6x150W Peripheral IR Heaters. The IR4100 does not require nozzles. A specially-developed IR pyrometer provides non-contact, real-time, closed-loop temperature control throughout the reflow process. A Sodr-Cam Reflow Camera comes standard, allowing you to watch the entire reflow process in real time. The IR4100’s Windows-based software makes profiling incredibly simple for even the most advanced applications, providing intuitive set-up, multi-stage profiling, on-the-fly profile adjustment, flux-dipping, unlimited profile storage and much more.

The IR4100 is specifically designed to rework large PCBs as big as 24″(610mm) x 24″(610mm). With its 6 independently controlled peripheral IR bottom heaters, the operator will be able to create an effective heating profile with ease, without fear of reflowing nearby components or joints. The IR4100’s uniquely designed Board Support Beam will keep any board from possible warping or sagging during a heating profile.

• No. 8007-0591
• Non-Contact IR Pyrometer
• Ultra-High Precision Placement Capability
• High Sensitivity Vacuum Pick
• Sodr-Cam Reflow Camera
• Height Adjustable Bottom-Side Preheater
• High-Definition Optical Alignment System
• Quad-Field Imaging for Large/Fine Pitch BGA’s
• Integrated Board Support Beam
• Power Distribution Graph
• Sensor Offset
• 24″ x 24″ (610mm x 610mm) Board Holder
• 6 Independently Controlled Peripheral Bottom Heaters
• Made in the USA

PACE TF 1800 BGA/SMD Rework System

Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACE’s TF 1800 BGA/SMD Rework System. With its groundbreaking, patented Inductive-Convection Heating Technology, the system’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.

(No. 8007-0574)

PACE TF2800 BGA/SMD Rework System

Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACE’s TF2800 BGA/SMD Rework System. With its groundbreaking, patented Inductive-Convection Heating Technology, the system’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.

• No. 8007-0582
• Ultra-Precise 28µm Placement Accuracy
• Revolutionary Inductive-Convection Heater
• Active Cooling Through Nozzle Provides Rapid Solder Cooldown
• 4 Thermocouple Inputs
• Adjustable Height Bottom-Side IR Preheater
• Board Support Beam
• Precision 24″ x 24″ PCB Holder
• Auxiliary Cooling Fan
• Motorized, High-Def (1080p) Optical Alignment System with Quad-Field Imaging
• Single-Axis Operation
• Windows 10 Micro PC with 24″ LCB Monitor
• Operator-Friendly Software Suite
• Made in the USA