SEC Die Bonders

Model 850 Flip Chip Placement System

Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up from a waffle pack, dipped into flux and then placed on a substrate.

An optional heated stage (Model 855) is available. An additional option, SEC´s Model 430 Hot Gas Jet Module can be integrated to operate on the Model 850 as a spot heating source for airflow.

• Manual X, Y sliding table with 13 ” x 5 ” of travel and ergonomic control arm.
• Micrometer adjusted X,Y and Theta stage for fine alignment.
• Pneumatic brakes for XY table movement.
• 4″ square flat vacuum chuck.
• Cube beam splitter vision system with simultaneous view of die and substrate patterns for alignment.
• Motorized zoom lens, color camera and TV monitor.
• Four independent fiber optic ring light illuminators. Two for die and two for substrate illumination.
• Viewer automatically retracts when Z motion is activated.
• Automatic Z motion with pneumatic bond control panel adjusted.
• Pick up tool.
• Set up kit.

Model 450 Hot Gas Rework Station

Using carefully regulated heat controls, this rework station quickly and easily removes surface mounted components and bonded die from PC boards, hybrid micro-circuits and packages without disturbing nearby components or damaging the removed device.

• Heated work holder with digital temperature controller adjustable to 350 º C (includes 2″ x 2″ vacuum chuck).
• Hot gas jet which directs up to 800 º C heated gas through an interchangeable quartz nozzle to a specific area.
• Voltage proportioning temperature controller for closed loop control of the hot gas temperature.
• Adjustable gas flow with indicator.
• Round or rectangular nozzles are available in a variety of sizes. One standard .060 I.D. nozzle comes with the system.
• The gas jet has .500 inch vertical travel with an additional 1.5″ adjustability for a total range of 2″.