DESCRIPTION
The Model 835 is a general purpose pick and place system for handling die and surface mount components. Its standard configuration features manually controlled Z motion with a drop down control arm for tool rotation and semiautomatic vacuum pickup for transferring die and other small devices from tape or waffle packs to gel packs or substrate.
Open frame design ensures full visibility and complete access to all system components. Various options can be easily added to the pick and place system including epoxy die bonding capability. The 835 works with any tape mounted die removal system, including S.E.C.’s Model 4800 die ejector grid featuring a grid plate that can be machined with one of two different pyramid pitches or straight pitch for picking up long narrow bars. Model 835 Pick and Place system is easy to operate can easily be customized.