DESCRIPTION
For over 40 years Semiconductor Equipment Corporation (SEC) has set the standard for high quality semiconductor Dicing Tape. The variety of tapes are
manufactured specifically for semiconductor wafer dicing and for ceramic hybrid substrate sawing. These tapes are also useful for surface protection and many other applications that require an adhesive tape with relatively low adhesion, no adhesive transfer, and the ability to stretch without tearing.
PRODUCT SPECIFICATIONS
- Standard Dicing Tape
- High Purity Tape
- Inkjet Cover Tape
- UV Curable Dicing Tape
- Heat Release Tape
- Aquabond Adhesives
- AQUACLEAN 900 Cleaning Agent
Standard Dicing Tape
The Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation. It is used extensively for Wafer Sawing, Scribing, Expanding. These tapes are available in rolls suitable for all automatic and manual wafer mounting systems where the wafers are being mounted onto tape and film frames.
Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker dicing tape.
High Purity Tape
Similar to the standard dicing tape, but the high purity pressure sensitive expandable tape with liner has low ionic impurities and adhesion stability, make it the perfect tape for your clean room application.
Inkjet Cover Tape
Similar properties as the standard dicing tape, but specifically used to apply tape to seal the ink cartridge against ink leakage during storage and transportation.
UV Curable Dicing Tape
Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.
Heat Release Tape
Made of Revalpha thermal release material that can be supplied in any combination of base film thickness, adhesive strength and release temperature.
- Revalpha is ideally suited for use in the widest range of electronic industry applications and promises to trim both labor and time costs. Use it for the temporary holding of parts in polishing, mounting or dicing processes.
- May be used to hold PCB’s during cutting or to prevent movement of parts, can transfer once-bonded parts to a variety of substrates.
- Revalpha can be used in LED etching, with piezoelectric devices in an electrode print process, or for the transfer of chips. It can be used as a FPC or chip carrier, making it ideal for continuous and/or automated operations.
- Also may be used for masking tape applications, as it provides effective plating and etching, with no deviations. Revalpha reliably protects the product during press punching – the sheet can be easily peeled off when heated, with no stress or damage. It is also recommended for lead frame punching and shadow mask in the etching process.
- It can be peeled off easily without force, and without any damage to the product. No adhesive residue remains on the product after peeling, no costly clean-up is needed and no contamination is caused by impurities from solvents.
Aquabond Adhesives
To reduce the reliance on chemicals in processes, SEC has developed a line of water soluble adhesives. Whether you are bonding quartz, fused silica, Bk7, garnet, sapphire, ceramics or other single crystal hard materials, they have the right temporary adhesive at the right bonding temperature for your process.
- Easy Removal: Debonding of parts after cutting or machining is accomplished using hot water and an Aquaclean water based cleaning agent, often accompanied by ultrasonic or air irrigation. This eliminates the use of acetone or aggressive solvents, which can be harmful to health and the environment.
- No Waste Requirements: With proper approvals, the spent cleaning solution can be sewer discharged.
- Improved Quality and Yields: High hardness and shear strength improves precision machining operations creating less attrition.
- Environmentally Friendly and Cost Effective: Following a simple debonding process using the aqueous cleaning agent, you will find your parts are much cleaner than using a typical thermoplastic stick followed by the solvent cleaning approach. Not only is the adhesive residue removed, but also oils and particles left by other areas of your process. Afterward, the cleaning solution can simply be poured down the drain. It does not need to be collected and further dealt with as hazardous
AQUACLEAN 900 Cleaning Agent
The AQUACLEAN 900 cleaning agent is a concentrated powder-form detergent designed to replace hazardous, toxic, or waste intensive materials. It is easily dissolved in aqueous cleaning systems and has been demonstrated to work well in removing a variety of materials.
- Removes AquaBond Adhesives in Minutes
- Powder-Form is Easy to Use
- Safe for Metals
- Environmentally and Worker Safe
- Water Solubility: 0-10%; Complete at > 40C
- pH of 1% w/w in H20: 11 – 12
- Ultrasonic and/or Heated Agitation Expedites and Reduces Cleaning Times