SEC Wafer Mounters

Model 300 Wafer/Film Frame Applicator

The Model 300 provides users with the optimal control of temperature and pressure for achieving uniform bubble-free mounting of electronic grade processing tape onto wafers and their film frames for subsequent cutting of wafers into die. The Model 300 is specifically designed for 300mm wafers.

• Up to 12” wafer capability standard.
• Accepts all film frames (specify type and size).
• Manual tape feed.
• Manual tape tensioner.
• Compatible with standard or interleaved tape.
• Vacuum stage wafer hold-down.
• Heated vacuum stage adjustable to 60 degrees C. maximum.
• Built in cutter tape separation systems.
• Captive roller assembly assures consistent wafer / film frame contact pressure.
• Adjustable spring loaded platen for optimum contact pressure.
• Standard aluminum anodized chuck for 300mm wafers or
• Teflon chuck for thin wafers to minimize stress during application.

Model 3100 Wafer/Film Frame Tape Applicators

Semiconductor Equipment Corporation’s Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. Uniform, bubble-free mounting of tape for wafer dicing is the result. State-of-the-art features make them two of the most advanced and versatile systems, they can operate with virtually any film frame.

• Up to 6″ wafer capability standard
• Accepts all film frames (specify type and size).
• Manual tape feed.
• Manual tape tensioner.
• Compatible with standard or interleaved tape.
• Vacuum stage wafer hold-down., adjustable to 60 º C. maximum.
• Built in peeler assembly for tape separation.
• Captive roller assembly assures consistent wafer/film frame contact pressure.
• Adjustable spring loaded platen for optimum contact pressure.

3150 Wafer/Film Frame Tape Applicators

Semiconductor Equipment Corporation’s Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. Uniform, bubble-free mounting of tape for wafer dicing is the result. State-of-the-art features make them two of the most advanced and versatile systems, they can operate with virtually any film frame.

• Up to 8″ wafer capability standard
• Accepts all film frames (specify type and size).
• Manual tape feed.
• Manual tape tensioner.
• Compatible with standard or interleaved tape.
• Vacuum stage wafer hold-down., adjustable to 60 º C. maximum.
• Built in peeler assembly for tape separation.
• Captive roller assembly assures consistent wafer/film frame contact pressure.
• Adjustable spring loaded platen for optimum contact pressure.

Model 3200 Wafer/Backlap Applicators

The Model 3200 apply protective tape to your wafer prior to backlapping:

• Eliminates bubbles between tape and wafer
• Provides uniform tension between tape and wafer
• Operates with backed and non-backed tape
• Provides adjustable roller pressure
• Cuts tape within .005 ” of edge of wafer
• Up to 6″ wafer capability standard.
• Trims tape to the edge of the wafer including the flats, within .005″.
• Manual tape feed.
• Manual tape tensioner.
• Compatible with standard or interleaved tape.
• Vacuum stage wafer hold-down.
• Built in cutter tape separation systems.
• Captive roller assembly assures consistent wafer/film frame contact pressure.
• Adjustable spring loaded platen for optimum contact pressure.

3250 Wafer/Backlap Applicators

The Model 3250 apply protective tape to your wafer prior to backlapping:

• Eliminates bubbles between tape and wafer
• Provides uniform tension between tape and wafer
• Operates with backed and non-backed tape
• Provides adjustable roller pressure
• Cuts tape within .005 ” of edge of wafer
• Four, five, six and eight inch wafer capability standard.
• Trims tape to the edge of the wafer including the flats, within .005 “.
• Manual tape feed.
• Manual tape tensioner.
• Compatible with standard or interleaved tape.
• Vacuum stage wafer hold-down.
• Built in cutter tape separation systems.
• Captive roller assembly assures consistent wafer/film frame contact pressure.
• Adjustable spring loaded platen for optimum contact pressure.